INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS

A. G. Harutyunyan; A. H. Kajoyan

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Title: INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS

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ISSN:

1829-1171

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Coverage:

178-182

Abstract:

Criteria and the corresponding approach for initial placement of integral circuit cells, providing topological homogeneity of the thermal field and increase in the thermal reliability, are proposed. The developed model allows using convenient computer methods.

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Date created:

2008-08-29

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pdf

Identifier:

oai:arar.sci.am:23197

Location of original object:

ՀՀ ԳԱԱ Հիմնարար գիտական գրադարան

Subject and keywords:

Physics Electronic and magnetic devices; microelectronics

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Digital Library > Articles

Last modified:

Dec 13, 2023

In our library since:

Feb 27, 2020

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https://arar.sci.am/publication/25899

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Armenian Journal of Physics=Ֆիզիկայի հայկական հանդես

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INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS	Dec 13, 2023

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Title: INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS

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