Object structure

Publication Details:

Established in 2008

Journal or Publication Title:

Armenian Journal of Physics=Ֆիզիկայի հայկական հանդես

Date of publication:

2008

Volume:

1

Number:

2

ISSN:

1829-1171

Official URL:


Title:

INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS

Creator:

A. G. Harutyunyan ; A. H. Kajoyan

Subject:

Physics ; Electronic and magnetic devices; microelectronics

Coverage:

178-182

Abstract:

Criteria and the corresponding approach for initial placement of integral circuit cells, providing topological homogeneity of the thermal field and increase in the thermal reliability, are proposed. The developed model allows using convenient computer methods.

Table of contents:


Place of publishing:


Digitisation sponsor:


Date created:

2008-08-29

Type:

Conference

Format:

pdf

Location of original object:

ՀՀ ԳԱԱ Հիմնարար գիտական գրադարան