@misc{A._G._Harutyunyan_INCREASE,
 author={A. G. Harutyunyan and A. H. Kajoyan},
 address={},
 howpublished={online},
 contents={},
 abstract={Criteria and the corresponding approach for initial placement of integral circuit cells, providing topological homogeneity of the thermal field and increase in the thermal reliability, are proposed. The developed model allows using convenient computer methods.},
 title={INCREASE IN THERMAL RELIABILITY OF INTEGRATED CIRCUITS AT THE STAGE OF PLACEMENT OF CELLS},
 type={Conference},
 keywords={Physics, Electronic and magnetic devices; microelectronics},
}